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| Products Electronic Adhesive EUBO Custom Adhesive for Smartphone Back Cover Bonding Suitable for Consumer Electronics Assembly
  • EUBO Custom Adhesive for Smartphone Back Cover Bonding Suitable for Consumer Electronics Assembly
  • EUBO Custom Adhesive for Smartphone Back Cover Bonding Suitable for Consumer Electronics Assembly
  • EUBO Custom Adhesive for Smartphone Back Cover Bonding Suitable for Consumer Electronics Assembly
  • EUBO Custom Adhesive for Smartphone Back Cover Bonding Suitable for Consumer Electronics Assembly
  • EUBO Custom Adhesive for Smartphone Back Cover Bonding Suitable for Consumer Electronics Assembly

    • EUBO Custom Adhesive For Smartphone Back Cover Bonding Suitable For Consumer Electronics Assembly

    • 411
    Product Review | Top Rated

    Specification Application 1. Smartphone Adhesive Delivery time 15-20 Days

      Additional Information

    • Color: Default Color
    • Size: Default Size
    • Origin: China
    • Usage: Default Usage
    • Type: Default Type
    • Efficiency: 99.9% Type
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    Description:

    Specification
    Application
    1. Smartphone Adhesive
    Delivery time
    15-20 Days
    Quality
    High-Quality
    Sample
    Samples Offered
    Factory
    Yes
     
     
    Product Description
    EUBO UR9665 is a custom adhesive specifically developed for smartphone back cover bonding. It provides strong adhesion, excellent
    durability, and reliable performance, making it ideal for structural bonding in consumer electronics. UR9665 is compatible with
    various materials commonly used in back cover assemblies, ensuring secure attachment and long-term stability even under
    challenging environmental conditions.
    Key Features:
    * Strong bonding performance for smartphone back covers
    * Excellent resistance to heat, humidity, and impact
    * Suitable for structural bonding of plastic, glass, and metal substrates
    * Supports automated dispensing and high-throughput production

    Typical Applications:
     * Smartphone back cover bonding
     * Structural bonding in mobile devices and other consumer electronics

     

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