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Specification Product Name High temperature grease
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Specification Product Name Food-Grade Silicone Grease
1. PFAS: An Urgent Hidden Source of Pollution PFAS (Per- and Polyfluoroalkyl Substances) are a class of persistent and toxic chemicals that are extremely difficult to degrade in the environment. They can accumulate through the food chain, posing significant risks to ecosystems and human health. Many countries worldwide have
Product Description:Reactive Polyurethane Hot Melt Adhesive (commonly known as PUR) is a solid at room temperature. Before use, it is heated to a molten state for dispensing. It is a one-component, solvent-free, hot melt structural adhesive that develops high initial bonding strength through physical solidification. Subsequently, it reacts with ambient moisture (from the
Product Features: This is a reactive polyurethane hot melt adhesive (PUR) that is solid at room temperature and melts upon heating before use. It is a single-component, solvent-free structural hot melt adhesive that achieves high initial bonding strength through physical solidification and subsequently crosslinks with moisture in
Product Features Reactive polyurethane hot melt adhesive (PUR) is solid at room temperature and is heated into a molten state before dispensing. It is a one-component, solvent-free structural hot melt adhesive that achieves high initial bonding strength through physical solidification. Subsequently, it reacts with moisture in the environment (from the substrate or air),
Product Features:Reactive polyurethane hot melt adhesive (PUR) is a solid at room temperature and melts upon heating before application. It is a single-component, solvent-free structural hot melt adhesive that achieves high initial bonding strength through physical solidification. Subsequently, moisture from the environment (substrate or air) triggers a chemical crosslink
Product Features:Reactive polyurethane hot melt adhesive (PUR) is solid at room temperature and must be melted by heating before dispensing. It is a single-component, solvent-free hot melt structural adhesive that achieves high initial bonding strength through physical solidification. Subsequently, moisture from the environment (substrate or air) triggers a chemical cross
Description:EP8210 is a solvent-free, environmentally friendly two-component structural adhesive. After mixing the two components, a crosslinking reaction occurs, resulting in cured bonding. It can cure at room temperature or be thermally cured. After curing, it exhibits excellent adhesion to most substrates
Description: EP8109 is a single-component, modified epoxy resin adhesive designed for BGA & CSP underfill processes. It forms a uniform and defect-free underfill layer, effectively reducing stress caused by the mismatch in overall thermal expansion between the silicon chip and substrate or by external forces. After thermal curing, the adhesive enhances the mechanical
