746EP 8108 is a single-component, modified epoxy resin adhesive used for BGA (Ball Grid Array) and CSP (Chip Scale Package) bottom filling processes. It forms a uniform, defect-free bottom fill layer that effectively reduces the mismatch in the overall thermal expansion properties between the silicon chip and substrate, as well as the impact caused by external forces. Once cured by heat, the a
EP 8108 is a single-component, modified epoxy resin adhesive used for BGA (Ball Grid Array) and CSP (Chip Scale Package) bottom filling processes. It forms a uniform, defect-free bottom fill layer that effectively reduces the mismatch in the overall thermal expansion properties between the silicon chip and substrate, as well as the impact caused by external forces. Once cured by heat, the adhesive improves the mechanical strength of the chip connection and enhances the product's performance, thereby extending its lifespan.
Storage and Shelf Life:
• The product should be stored in vacuum-sealed aluminum foil bags in a dry environment, with a temperature range of 15°C to 25°C.
• The shelf life of unopened product is 6 months.
Health and Safety Measures:
• Please refer to the Material Safety Data Sheet (MSDS) for proper handling and disposal instructions.
Limited Warranty Information – Please Read Carefully:
The information provided herein is accurate to the best of our knowledge. However, since the conditions and methods of use are beyond our control, this information cannot replace customer testing to ensure the product’s safety, effectiveness, and suitability for specific end uses. Our recommendations should not be considered a basis for patent infringement.
This document does not include all safety information required for the safe use of the product. Please read the product's safety data sheet and container labels before use to obtain information about safe handling and health hazards.
Applications:
Suitable for high-reliability board-level CSP (Chip Scale Package), BGA (Ball Grid Array) packaging, and chip-level FC-BGA (Flip Chip Ball Grid Array) packaging applications.
Technical Parameters of Underfill EP 8108
|
Product |
EP 8108 |
|
Application |
BGA/CSP Bottom Fill |
|
Appearance |
Black |
|
Viscosity |
400 mPa·s |
|
Curing Condition |
8 minutes @ 130°C |
|
Coefficient of Thermal Expansion |
58/175 ppm |
|
Tg (Glass Transition Temperature) |
105°C |
|
Storage Condition |
6 months @ -20°C |
Electronics assembly is a complex manufacturing process that depends on tight tolerances and delicate adhesive bonding. Most two-part adhesives require precise mixing and deliver weak bonding if the mixing ratio does not match. And the end result is underfilling voids that crack BGAs during reflow, and bonds that loosen after a few hundred thermal shocks. EP 8108 is a single-component, heat-curable epoxy that has simple formulation that deals with these issues. It flows where you need it, cures fast at 130°C, and stays rigid under vibration without stressing fragile components.
Buying adhesive by the syringe is not enough if you are doing large-scale manufacturing. Our supply is exactly for these kinds of demand. You buy by the or the pallet and your cost per gram shrinks as your volume grows. We structure wholesale pricing with transparent breakpoints, no tier surprises, and fixed rates for repeat orders. Our supply chain is regional and responsive: standard lead times under 5 days, emergency expediting available, and custom packaging (syringes, cartridges, or bulk pails) to match your dispensing equipment.
Do I really need to refrigerate this stuff, or is that just overkill?
Yes, refrigerate it but don't overthink it. Store between 2–8°C and it stays stable for a full 12 months. Leave it out at room temp for weeks, and you'll shorten that shelf life fast. Pop it in the fridge, thaw it to room temp before use, and you're golden.
2. Can I cure it faster if I crank the temperature above 130°C?
You can, but we don't recommend it. 130°C for 8 minutes is the sweet spot go hotter and you risk stressing nearby components or uneven curing. Stick to the spec. If you're in a real rush, talk to us about a tailored ramp profile; we've got options.
